Objective: To conduct thermal aging tests on Quad Lock’s phone cases and mounts using Thermoline ovens, simulating long-term environmental exposure in high-temperature conditions. The tests aimed to ensure that these products could endure extreme heat without performance degradation.
Both ovens featured the Omron-MSP controller, a multi-setpoint programmable controller that allowed for precise ramp and dwell temperature control, ensuring accurate simulation of real-world conditions. This enabled Quad Lock to create temperature cycles where the heat increased and decreased gradually over set periods, replicating conditions such as daytime heat buildup in cars.
1. Omron-MSP Controller Integration:
2. Thermal Aging Tests:
Testing in the TD-250F: This smaller oven was used for initial tests on phone cases, exposing them to temperatures up to 120°C over cycles simulating daily heat exposure in a controlled environment.
Real-Time Monitoring in the TD-500F: The larger oven, featuring the custom window, allowed engineers to observe how the phone mounts responded to prolonged heat exposure. The Omron-MSP controller managed complex temperature profiles to replicate the heat cycle a phone mount might experience in a vehicle.
Phone Mounts: The mounts proved extremely resilient, even after extended heat cycles. Thanks to the ramp and dwell control provided by the Omron-MSP, Quad Lock was able to simulate real-world heating patterns, verifying that their mounts can endure extreme temperatures without losing grip or strength.
Thermal aging tests conducted with Thermoline's TD-250F and TD-500F ovens validated the long-term durability of Quad Lock’s phone mounts and cases. The tests successfully demonstrated that these products can withstand significant environmental stress, particularly the high heat they would encounter inside vehicles.